ILLIG – a leading global supplier of thermoforming systems and tool systems for thermoplastics and cardboard – is to showcase its new sustainable, all-paper blister-pack innovation at Fachpack, when the premier packaging show returns to Nuremberg from 28–30 November 2021.

 

German firm ILLIG Maschinenbau will demonstrate to attendees of the leading industry event how the production of sustainable all-paper blisters from recycled cardboard with different designs and contents – for both food and other applications – is possible on a single, flexible packaging system.

Less is more: Reduce, Re-use, Separate, Recycle, Renew



As part of Fachpack in November – located at Booth 205 in Hall 1 – ILLIG will present the latest version of the HSU 35b packaging series. 

The system is suitable for safe sustainable blister packaging made of cardboard-plastic-cardboard combinations (double card blister) or solid cardboard for non-food products. 

The economical and efficient HSU 35b is designed for variable blister heights and can be configured with 3, 6, 8, 10 or 12 transport pallets for any application. 

The compact machine adapts to the individual requirements of packaging manufacturers with numerous equipment features. Examples include automatic product feeding, product presence control, product inlay (fixation in the carton blister), inserts for brochures, marking systems, code readers and blister lifters.

As ILLIG packaging systems are modular, flexible and efficient, they enable brand owner and co-packers alike the freedom to design sustainable packaging for a variety of end markets.